Countdown:
Paper submission due:
December 31, 2026
Paper acceptance due:
January 31, 2027
Registration deadline:
February 28, 2027
Conference date:
April 9-11, 2027
Organizing Committee Chair
Gordana Jovanovic Dolecek, Institute INAOE, Mexico
Technical Committee Member
Robert Wu, University of Technology Sydney, Australia
Sirje Virkus, Tallinn University, Estonia
Vinayak Ashok Bharadi, Finolex Academy of Management and Technology, India
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Email:
2027 International Conference on Data Engineering and Intelligent Systems (DEIS 2027) will take place in Hangzhou, China, from April 9-11, 2027.
DEIS 2027 focuses on cutting-edge advances in big data engineering, artificial intelligence and practical deployment of intelligent systems. As an international academic event, it brings together scholars from global universities, research institutions and high-tech enterprises. Aligned with the development trends of digital economy and next-generation information technologies, the conference builds an international platform for industry-university-research collaboration. It addresses theoretical innovations and practical engineering challenges covering the full lifecycle of data processing and intelligent systems, facilitating in-depth academic exchanges and technical cooperation among worldwide researchers and engineering practitioners.