Countdown:
Paper submission due:
December 31, 2026
Paper acceptance due:
January 31, 2027
Registration deadline:
February 28, 2027
Conference date:
April 9-11, 2027
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Email:
2027 International Conference on Data Engineering and Intelligent Systems (DEIS 2027) will take place in Hangzhou, China, from 9-11, 2027.
DEIS 2027 focuses on cutting-edge advances in big data engineering, artificial intelligence and practical deployment of intelligent systems. As an international academic event, it brings together scholars from global universities, research institutions and high-tech enterprises. Aligned with the development trends of digital economy and next-generation information technologies, the conference builds an international platform for industry-university-research collaboration. It addresses theoretical innovations and practical engineering challenges covering the full lifecycle of data processing and intelligent systems, facilitating in-depth academic exchanges and technical cooperation among worldwide researchers and engineering practitioners.